Engineers use a redistribution layer (RDL) in flip-chip designs to redistribute I/O pads to bump pads without changing the I/O pad placement. However, traditional routing capacity may be insufficient ...
At the recent TSMC OIP Symposium, John Park presented ‘Advanced Auto-Routing for TSMC InFO Technologies.’ InFO stands for “integrated fanout” and is the lower performance, lower complexity technology ...
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