Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs. BGA ...

This blog discusses several challenges behind developing mmWave radar systems for the next generation of smart cars and trucks and looks at new capabilities recently added to electronic design ...

Power supply noise and related issues have become critical for designs at 90nm and below due to the combination of several factors. Timing slowdown and functional failures are becoming common in these ...